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ProbeMax™ is the Gel-Pak® probe card cleaning and polishing product line. Gel-Pak® is one of the original manufacturers of probe card cleaning and polishing products used by the semiconductor industry.
ProbeMax™ film product is made from a highly cross-linked polymer material designed to remove and capture loose debris that accumulate on the probe tip, tip length, and electrical contact area of the probe tip during probing.
ProbeMax™ is designed to be used both in-line and off-line to effectively maintain the highest level of yield at wafer test, while reducing the overall cost of ownership.
Available as ProbeMax ReMove™ and ProbeMax ReFine™, these materials over the last 15 years have become the industry standard for cleaning a broad array of probe card types. ProbeMax ReFine™ and ProbeMax ReMove™ are able to effectively and non-destructively remove and capture debris and build-up, without contributing to probe card wear.
ProbeMax™ products are also available in a silicon wafer format (100mm, 150mm, 200mm, or 300mm). ProbeMax™ cleaning and polishing films exert low forces on the probe tip in the Z (vertical) direction, which are less than the forces found during normal test conditions. No lateral forces are applied to the probes tips thus preventing potential probe misalignment and damage issues.
ProbeMax™ film product is made from a highly cross-linked polymer material designed to remove and capture loose debris that accumulate on the probe tip, tip length, and electrical contact area of the probe tip during probing.
ProbeMax™ is designed to be used both in-line and off-line to effectively maintain the highest level of yield at wafer test, while reducing the overall cost of ownership.
Available as ProbeMax ReMove™ and ProbeMax ReFine™, these materials over the last 15 years have become the industry standard for cleaning a broad array of probe card types. ProbeMax ReFine™ and ProbeMax ReMove™ are able to effectively and non-destructively remove and capture debris and build-up, without contributing to probe card wear.
ProbeMax™ products are also available in a silicon wafer format (100mm, 150mm, 200mm, or 300mm). ProbeMax™ cleaning and polishing films exert low forces on the probe tip in the Z (vertical) direction, which are less than the forces found during normal test conditions. No lateral forces are applied to the probes tips thus preventing potential probe misalignment and damage issues.